Sample Preparation & Fabrication

Thin Film Techniques

Kurt J Lesker Multi-chamber, multi-user Deposition System

This has a central deposition chamber (CDC) with a robotic arm to load substrates and masks into one of up to six satellite chambers. Existing chambers allow sputter deposition of magnetic and non-magnetic metals and insulators. There is also a facility to co-evaporate Ga during sputtering of a magnetic metal, established as part of our programme on magnetostrictive thin films. This facility is in the 550 m2 Class 100 cleanroom that is part of the University of Sheffield Centre for Nanoscience and Technology. Another chamber on the system is used by colleagues in the Molecular and Macromolecular Materials group, Department of Physics and Astronomy for deposition and processing of organic films.

Nordiko NM2000 RF Magnetron Sputtering System

The Nordiko has a sputtering system consisting of 3 different target materials which can be mounted on the rotatable stage which allows deposition of multilayer thin films.

Vacuum pressure can reach as low as 10 – 7 Torr (approx. 1333Pa - 933Pa of pressure).

A magnetic field can be deployed on the substrate holder to induce magnetic anisotropy during the fabrication process, as well as controlling the temperature of the substrate holder by either water cooling or heating (up to 500°C).

Kurt J Lesker DC Magnetron Sputtering System

This currently has three 5 cm diameter target electrodes angled so that sputtered particles are coincident on the substrate. The substrate may be taken through any range of thermal cycles, with a peak substrate temperature of 1073 K (around 800°C).

Wordentec Thermal Evaporator

This system is designed to be compatible for use with resist-based lithography processes and is used to fabricate magnetic nanostructures. Deposition can be switched between three crucibles, allowing multilayer deposition to be performed. A carousel sample mount and masked deposition allows up to six different depositions.

Spin Coating

Patterning Techniques


Electron Beam Lithography

Focussed Ion Beam Milling